Plasma-Therm LAPECVD™ - Large Area Plasma Enhanced Chemical Vapor Deposition

The LAPECVD™ platform can be used to deposit a variety of thin film materials with its parallel-plate plasma deposition system.

Plasma-Therm’s LAPECVD™ (Large Area Plasma Enhanced Chemical Vapor Deposition) uses a cassette-to-cassette configuration to allow for high volume production in a wide range of applications.

The LAPECVD™ platform can be used to deposit a variety of thin film materials with its parallel-plate plasma deposition system.

Hardware

Cassette-to-Cassette Handling
- Multi substrate batch processing
Dual cassettes
Platen heating up to 350°C
Upper electrode RF power at 13.56 MHz with optional MFD
Up to 8 channels with digital MFCs
Thermally managed reactor design—up to 175°C for internal walls and shower head

Endpoint
Integrated multifunctional endpoint capability with EndpointWorks.

Unique OEI application for real-time film thickness and rate monitoring.
OES for optimized chamber clean.

Software

User friendly software
Comprehensive data logging
Automated cleaning program
Real-time process data display
Fully integrated endpoint system
Factory automation compatible (SECS/GEM)
Edit recipes during runs
Multiple user access levels
Alarm history

Process

Stress control
High uniformity
Low damage
Low particulates
Tunable index
Increased productivity with batch loading capability
Low temperature

Buxco

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