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Die Bonder

Die Bonders are precision machines used to attach microelectronic devices, such as semiconductor chips or die, onto substrates. They use thermal compression, ultrasonic, and thermosonic bonding techniques to create a strong, reliable connection. They are widely used in the production of microelectronic components and play a critical role in ensuring reliability and performance. Die Bonders come in different models, from manual benchtop systems to automated production systems, and can be designed with special features for in-situ process control. They are a key tool in microelectronics manufacturing and provide a cost-effective solution for die bonding needs.

Die Bonder

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