New AccuThermo AW 410 for 2 to 4 inch wafer RTA

Allwin21 is the exclusive licenced manufacture for AG Heatpulse 610. Allwin21 is manufacturing the AccuThermo AW-610,originally the AG Heatpulse 610.The AccuThermo AW-610 has innovative software and more advanced temperature control technologies

AccuThermo AW 410M is a desktop rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity advanced temperature control technology and AW 900 new software, provide significant advantages over conventional furnace processing and conventional RTP systems.
The Key strength of AccuThermo AW 410 is as following.

• Wafer Sizes Capacity: 2-4"
• Advanced ERP Pyrometer for precise high temperature measurement
• Add timer watch for the oven safety issue (the original has no safety interlock for the computer locks up, chamber would be burned if the computer locks up when process running).
• The new software with power summary function to detect either lamp failure or sensor failure
• Advanced Bench Top Rapid Thermal Process System
• Up to 6 gases channel control capability
• Pentium PC compatible computer
• Integrated process control system
• Real time graphics display,
• Recipe editing and validation, and
• Real time process data acquisition, display, and analysis
• Comprehensive calibration
• Diagnostic functions
• Including lamp calibration and monitoring.
• Manual Operation
• Sensor status detect function
• On line help

Rapid thermal processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so they do not break due to thermal shock..Such rapid heating rates are attained by high intensity lamps process. These processes are used for a wide variety of applications in semiconductor manufacturing including dopant activation, thermal oxidation, metal reflow and chemical vapor deposition.

Rapid thermal anneal (RTA) is a process used in semiconductor device fabrication which consists of heating a single wafer at a time in order to affect its electrical properties. Unique heat treatments are designed for different effects. Wafers can be heated in order to activate dopants, change film-to-film or film-to-wafer substrate interfaces, densify deposited films, change states of grown films, repair damage from ion implantation, move dopants or drive dopants from one film into another or from a film into the wafer substrate. Rapid thermal anneals are performed by equipment that heats a single wafer at a time using lamp based heating that a wafer is brought near. Unlike furnace anneals they are short in duration, processing each wafer in several minutes. Rapid thermal anneal is a subset of processes called Rapid Thermal Process (RTP).

Allwin21 Corp is a LabX Sponsor.
Please visit their website at: http://www.allwin21.com