Leica AS LMD microdissection microscope

Here are the part numbers 1-Hitachi Hv-20A

1-CTR-MIC a.XY stage z-control xyz control DL b.Fx-Bus RS232C Control panel Microscope c.Well Handeling AZ (01) Trigger LMR unit

1- Ebg 100 isolated

1- laser

1- Dell Computer

1-17" LCD

1-H pl Floutar 10x10.30 PHI

1-HCXPL 40x10.60 corr XT

1- C Plan 4X10.10

1-N Plan L 20x10.40 Corr PH

All the Manuals come with this unit.

Leica AS LMD Overview

Laser microdissection has established itself as a powerful technology essential to a range of downstream applications in pathology, cancer research, life sciences, medical diagnostics and biotechnology.

The Leica AS LMD offers a powerful tool for contamination free separation of cells or cell groups in preparation for PCR, RT-PCR and Proteomics, to name a few.

The Leica AS LMD, a "third-generation" micro-dissection platform, was developed combining automated upright microscope architecture, three-dimensional optical control of the dissecting laser beam and the dissected area, non-contact tissue sampling and motorized post-dissection handling Technical Data Leica AS LMD

Leica DM LA

* Motorized objective nosepiece * Motorized specimen movement (xy) * Motorized focusing (z)

Laser

* Maintenance-free nitrogen laser / Warranty 20,000,000 pulses or 2 Years * Wavelength 337.1nm / BW 0.1nm * Pulse repeat rate up to 30Hz * Pulse duration < 4ns * Peak performance 75kW / average 7.2 mW @ 30Hz * Beam divergence 0.3mrad

Lasermodule

* Motorized optical beam scanning * Motorized setting of laser illumination aperture * Focus offset and laser attenuation * Collection tray for dissected material, with quick-change mount * Motorized positioning of collection tray * The smallest cutting area with the 100x objective has a diameter of 4-5µm with an accuracy of +/- 0,6 µm * "Unlimited definition" of shapes with draw function * Compatible with a wide range of objectives (4X - 100X)

Software

* Control of all motorized microscope functions and laser movements * Display of microscope image on the PC monitor using 3CCD camera * "Incision path marking" with correction facility * Storing of images in a database for documentation of "different processing" * Inspection Mode to control the result of the dissection * Simple automated calibration of the whole system