Side Sputtering System Capable up to 6" Wafers - Three Target RF & DC Side Sputtering System With Etch
Features:
- Three targets 5 in. x 15 in.
- Sputter etch capability
- Quartz substrate heaters, substrate
- Substrate carrier 13 in. x 13 in
- Cryo pump and roughing pump.
Specifications:
- Temperature adjustable to 400 deg. C
- Optional 3 kW 13.56 MHz RF generator 10 kW DC Magnetron power supply adjustable to 850 V and 25A.