Description: Perkin Elmer 4450
Perkin Elmer 4450 Sputtering system is a delta target sputtering system, similar to the Perkin Elmer 4410  ... Read More
Escrow: I accept escrow, if buyer pays escrow charges
Terms & Conditions:
*Lead Time for New Equipment varies. Please inquire.
*There is no Lead Time for some Used equipment. Please
inquire.
*Warranty is optional;
*Installation is optional;
*Facility is the buyer responsibility.
Hits: 4796 | Views: 181
Ad Description
Perkin Elmer 4450
Perkin Elmer 4450 Sputtering system is a delta target sputtering system, similar to the Perkin Elmer 4410 with load lock pumping and heating incorporated as standard features.Perkin-Elmer's Model Perkin Elmer 4450delta cathode production sputtering system is designed for high yield in production environments demanding maximum throughput for metal deposition. It also provide a high level of flexibility in process control for other materials.
Perkin Elmer 4450uses a delta-shaped cathode that eliminate the need for a large-area uniformity-shaping aperture. This dramatically increases throughput while maintaining high wafer-to-wafer uniformity.
Contrasted with circular cathodes, target utilization is substantially higher. Up to 35% of the target can be sputtered before target change, and some 60% of the sputtered material actually reaches the substrate pallet. This results in a lower cost per wafer and less frequent target changes. Up to three delta or 8-inch round targets may be installed for sequential deposition of three different materials without breaking vacuum.
Perkin Elmer 4450 employs a fast cycle load lock, two-stage cryopump and full flood Meissner trap to maintain the process chamber at high vacuum and in a clean condition at all times. The process chamber is fabricated of stainless steel for contamination-free performance. A base pressure better than 5 X 10-7 Torr is achieved within 3.5 minutes from loading substrates into the load lock. Typical cycle time, with optional load lock heating and pumping, is 12 to 15 minutes for the deposition of 1 micron of aluminum.