Semiconductor > Dicing Saws > K&S - 775 Wafer Dicing Saw. Older saw. 2 in. dia. spindle. Cutting Range: 0 to 6

For Sale Listings For Sale: K&S - 775 Wafer Dicing Saw. Older saw. 2 in. dia. spindle. Cutting Range: 0 to 6

Posted: Monday, May 21, 2012    Location: Freehold, New Jersey, USA

Ad Details - #16412800 - Archived Ad
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  • Item ID: 50804
  • Make: K&S
  • Model: 775
  • Price: 1,000 AS IS Availability: In Stock
  • Description: Wafer Dicing Saw. Older saw. 2 in. dia. spindle. Cutting Range: 0 to 6 in. Stroke: 10.5 in. Sold AS IS, Parts Unit.