Semiconductor >
Dicing Saws >
Esec 8003 Esec The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut
For Sale: Esec 8003 Esec The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut
Posted: Thursday, May 24, 2012 Location: North Billerica, Massachusetts, USA
Ad Details - #16487960 - Archived Ad
This LabVista ad has been archived.
- Other ads by this seller in this category:
- SEC
- DISCO DAD 2H/6
- DISCO DAD 2SP6T
- DISCO DAS 6IL
- DISCO MICROSCOPE
- See current LabVista ads in this category: Dicing Saws
- Search current ads
- For complete details on this ad and others, search the archive
- Make: Esec
- Price: Please Email Availability: In Stock
- Description: The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuc [description truncated]
Follow us on Twitter