Semiconductor > Dicing Saws > Esec 8003 Esec The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut

For Sale Listings For Sale: Esec 8003 Esec The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut

Posted: Wednesday, May 30, 2012    Location: North Billerica, Massachusetts, USA

Ad Details - #16684156 - Archived Ad
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  • Make: Esec
  • Price: Please Email Availability: In Stock
  • Description: The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuc [description truncated]