For Sale: Toray OF2500 Flip-Chip Bonder for sale
Originally Found: Tuesday, May 21, 2013 Location: Decatur, Georgia, USA
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Ad Details - #LV28938536
LabX Member since August 2006.
ClassOne specializes in selling high quality preowned equipment to the Semiconductor and Nanotechnology Industries including MEMS, Compound Semiconductors, Optoelectronics, Microelectronics, Science, and Technology. We focus on equipment used for wafer fabrication, metrology, assembly, and test. We strive to offer high quality equipment in excellent condition at the most competitive prices.
Ad DescriptionToray OF2500 Flip-Chip Bonder for sale
TORAY OF2500 FLIP CHIP BONDER consisting of: - Model: OF2500-07- Super High Accuracy Flip Chip Bonder (for optical devices) - Toray OF2000 Series Flip Chip Bonder- Head has a Bond Force Range of 0 - 10 N (low pressure) and can heat up to 500C in a few seconds- Substrate Heater (lower heater) has a Temperature Range of 0 - 400C- Micron Accuracy: +/- 0.5 (x and y axis)- Theta Accuracy: 0.3 deg- Substrate Heated Stage: 0-400C- At Head Attachment: 0-500C (for die/chip)- 5"/4"/3" Wafers including small pieces (substrate size)- Chip/Die size depends on Attachment Tool (1mm x 2mm die were previously used. Have heard of as small as 200um x 200um and as large as 15mm x 15mm, with 10mm x 10mm bonding pad area.)- Bonding Force: 0-10 N- Auto Alignment / Mark Detection for Automatic Bonding - IR inspection- Auto parallel function- Active anti-vibration- N2 purge stage- Data logger, Ionizer, Vacuum pump, Auto Tool Changer- Operations Manuals for Toray OF2000/OF2500 Bonder- Recently serviced and PM'd by Toray factory technician- Available for full inspection and demonstration- More information: http://www.toray-eng.com/semicon/bonder/flip-lineup/of2000.html
Toray OF2500 Flip-Chip Bonder for sale
Please note: Originally found: Tuesday, May 21, 2013