For Sale: Toray OF2500 Flip-Chip Bonder for sale

TORAY OF2500 FLIP CHIP BONDER consisting of: - Model: OF2500-07- Super High Accuracy Flip Chip Bonder (for optical devices) - Toray OF2000 Series Flip Chip Bonder- Head has a Bond Force Range of 0 - 10 N (low pressure) and can heat up to 500C in a few seconds- Substrate Heater (lower heater) has a Temperature Range of 0 - 400C- Micron Accuracy: +/- 0.5 (x and y axis)- Theta Accuracy: 0.3 deg- Substrate Heated Stage: 0-400C- At Head Attachment: 0-500C (for die/chip)- 5"/4"/3" Wafers including small pieces (substrate size)- Chip/Die size depends on Attachment Tool (1mm x 2mm die were previously used. Have heard of as small as 200um x 200um and as large as 15mm x 15mm, with 10mm x 10mm bonding pad area.)- Bonding Force: 0-10 N- Auto Alignment / Mark Detection for Automatic Bonding - IR inspection- Auto parallel function- Active anti-vibration- N2 purge stage- Data logger, Ionizer, Vacuum pump, Auto Tool Changer- Operations Manuals for Toray OF2000/OF2500 Bonder- Recently serviced and PM'd by Toray factory technician- Available for full inspection and demonstration- More information: http://www.toray-eng.com/semicon/bonder/flip-lineup/of2000.html