New Solstice LT Electroplating System

for R&D and Low Volume Applications

Our flexible Solstice^® single-wafer platform offers a broad portfolio of electroplating and surface preparation applications on a single, compact system. Engineered for reliability and uptime, Solstice delivers advanced performance with maximum throughput and wafer uniformity. Our team of process equipment experts integrated reliable, high-integrity, best-in-class components into an elegantly designed family of systems that are allow you to realize unparalleled cost efficiency and ROI.

Available with up to 3, 4 or 8 chambers, The Solstice platform can accommodate a variety of substrate types, from traditional silicon devices to compound semiconductors and emerging materials like glass. The systems can reliably and expertly process wafers down to 75mm in diameter — whether mounted, thinned, flatted, bowed, or transparent — and can handle multiple wafer sizes on a single system. Wafer rotor changes take less than 5 minutes, minimizing system downtime and contributing to the platform’s ease of operation and maintenance.

The Solstice LT offers semi-automated single-wafer process development with up to three chambers

Key Benefits:

Ideal for low-volume, R&D processing
Economical entry to single-wafer processing
Improved process quality and consistency
Easy scale-up path to automated production
Smallest Solstice system footprint

The Solstice^® LT a full-featured, easy-to-use for electroplating and surface preparation application, can process a broad range of wafer sizes down to 75mm. In addition to electroplating, the system can perform high-pressure metal lift-off (MLO) spray acid applications such as UBM etch, and more. The LT accommodates up to three chambers for manual-load, semi-automated process development, or low-volume or R&D production. The systems use the same software and controls, and the same selection of chambers as the Solstice S4 and S8 configurations, providing an easy scale-up to automated production as capacity need expand.

The Solstice LT system chambers may be configured with a mix of different plating and surface prep chambers, including: GoldPro, CopperMax, Wet Etch, MLO, and Advanced Packaging.

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