TESCAN introduces the MIRA XR, an ultra-high-resolution scanning electron microscope (SEM) integrated with energy-dispersive X-ray spectroscopy (EDS), designed for rapid and precise materials analysis in both academic and industrial settings. Bridging the gap between conventional field emission SEMs and ultra-high-resolution systems, the MIRA XR offers analytical flexibility, user-friendly operation, and streamlined workflows.

Key Features of the TESCAN MIRA XR

• BrightBeam™ Technology: Achieves sub-nanometer resolution at low accelerating voltages, enabling detailed imaging of nanoscale structures.

• Dual Essence™ EDS: Reduces elemental analysis turnaround time by up to 50%, enhancing workflow efficiency.

• Wide Field Optics™: Speeds up sample navigation by 40%, facilitating quicker identification of regions of interest.

• MultiVac™ Mode: Allows low-vacuum operation for beam-sensitive and outgassing samples, minimizing the need for extensive sample preparation.

• In-Flight™ Automation: Simplifies imaging processes, making high-resolution imaging accessible to users of all experience levels.

The MIRA XR is engineered for high-throughput environments, including quality control, metallurgy, battery research, and semiconductor failure analysis, where both speed and imaging accuracy are critical.